| European Case Law Identifier: | 
ECLI:EP:BA:1997:T059494.19970422 | 
| Date of decision: | 
22 April 1997 | 
| Case number: | 
T 0594/94 | 
| Application number: | 
88117298.5 | 
| IPC class: | 
H01L 23/538 | 
| Language of proceedings: | 
EN | 
| Distribution: | 
C | 
| Download and more information: | 
 | 
| Title of application: | 
Semiconductor chip package | 
| Applicant name: | 
SAMSUNG ELECTRONICS CO., LTD | 
| Opponent name: | 
 -  | 
| Board: | 
3.4.01 | 
| Headnote: | 
 -  | 
| Relevant legal provisions: | 
 | 
| Keywords: | 
Inventive step (yes, after amendment) | 
| Catchwords: | 
 
			 - 
			 
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| Cited decisions: | 
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| Citing decisions: | 
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1 references found. 
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Case Law Book: III Amendments
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