| European Case Law Identifier: | ECLI:EP:BA:2014:T173609.20140130 | ||||||||
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| Date of decision: | 30 January 2014 | ||||||||
| Case number: | T 1736/09 | ||||||||
| Application number: | 01200301.8 | ||||||||
| IPC class: | H01L 23/498 | ||||||||
| Language of proceedings: | EN | ||||||||
| Distribution: | C | ||||||||
| Download and more information: |
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| Title of application: | Semiconductor chip assemblies, methods of making same and components for same | ||||||||
| Applicant name: | TESSERA, INC. | ||||||||
| Opponent name: | STMicroelectronics, Inc. | ||||||||
| Board: | 3.4.03 | ||||||||
| Headnote: | - | ||||||||
| Relevant legal provisions: | |||||||||
| Keywords: | Amendments - relationship between Art. 123(2) and Art. 123(3) Amendments - broadening of claim (no) Remittal to the department of first instance |
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| Catchwords: |
In determining whether amendments made in opposition proceedings comply with the requirements of Article 123(3) EPC, the protection conferred by European patent is determined by the claims of the granted patent, the description and drawings of the granted patent being used to interpret the claims in accordance with Article 69(1) EPC and its Protocol (see point 1.1.8). |
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Source: http://www.epo.org/law-practice/case-law-appeals/recent/t091736eu1.html
Date retrieved: 17 May 2021