| European Case Law Identifier: | ECLI:EP:BA:2003:J000902.20030522 | ||||||||
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| Date of decision: | 22 May 2003 | ||||||||
| Case number: | J 0009/02 | ||||||||
| Application number: | 99125769.2 | ||||||||
| IPC class: | B23K 1/00 | ||||||||
| Language of proceedings: | EN | ||||||||
| Distribution: | D | ||||||||
| Download and more information: |
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| Title of application: | Solder ball connections and assembly process | ||||||||
| Applicant name: | International Business Machines Corporation | ||||||||
| Opponent name: | - | ||||||||
| Board: | 3.1.01 | ||||||||
| Headnote: | - | ||||||||
| Relevant legal provisions: | |||||||||
| Keywords: | Application of Article 4.1 of the Decision of the Administrative Council of 13 October 1999 as transitional provision with respect to Rule 25(2) EPC | ||||||||
| Catchwords: |
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Source: http://www.epo.org/law-practice/case-law-appeals/recent/j020009eu1.html
Date retrieved: 17 May 2021
8 references found.
Click X to load a reference inside the current page, click on the title to open in a new page.Offical Journal of the EPO
Case Law Book: II Conditions to be met by an Application
XCLR II F 3.5.7 Pendency in case of deemed withdrawal of earlier application and no reaction to loss of rights communication under Rule 112(1) EPC